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7 件の該当がありました. : このページのURL : HTML


論文誌
[1] T. Kanamoto, T. Ikeda, A. Tsuchiya, H. Onodera, and M. Hashimoto, "Si-Substrate Modeling Toward Substrate-Aware Interconnect Resistance and Inductance Extraction in SoC Design," IEICE Trans. on Fundamentals of Electronics, Communications and Computer Sciences, volume E89-A, number 12, pages 3560-3568, December 2006. [3.pdf]
[2] T. Sato, J. Ichimiya, N. Ono, K. Hachiya, and M. Hashimoto, "On-Chip Thermal Gradient Analysis and Temperature Flattening for SoC Design," IEICE Trans. on Fundamentals of Electronics, Communications and Computer Sciences, volume E88-A, number 12, pages 3382-3389, December 2005. [9.pdf]
国際会議
[1] Q. Cheng, Q. Li, L. Lin, W. Liao, L. Dai, H. Yu, and M. Hashimoto, "How Accurately Can Soft Error Impact Be Estimated in Black-Box/White-Box Cases? -- a Case Study with an Edge AI SoC --," Proceedings of Design Automation Conference (DAC), 採録済.
[2] S. Sombatsiri, J. Yu, M. Hashimoto, and Y. Takeuchi, "A Design Space Exploration Method of SoC Architecture for CNN-based AI Platform," Proceedings of Workshop on Synthesis and System Integration of Mixed Technologies (SASIMI), October 2019.
[3] Y. Ogasahara, M. Hashimoto, and T. Onoye, "Dynamic Supply Noise Measurement Circuit Composed of Standard Cells Suitable for In-Site SoC Power Integrity Verification," Proceedings of Asia and South Pacific Design Automation Conference (ASP-DAC), pages 107--108, January 2008. [97.pdf]
[4] T. Kanamoto, T. Ikeda, A. Tsuchiya, H. Onodera, and M. Hashimoto, "Si-Substrate Modeling Toward Substrate-Aware Interconnect Resistance and Inductance Extraction in SoC Design," In Proceedings of IEEE Wrokshop on Signal Propagation on Interconnects (SPI), pages 227-230, May 2006. [65.pdf]
[5] T. Sato, N. Ono, J. Ichimiya, K. Hachiya, and M. Hashimoto, "On-Chip Thermal Gradient Analysis and Temperature Flattening for SoC Design," In Proceedings of Asia and South Pacific Design Automation Conference (ASP-DAC), pages 1074-1077, January 2005. [34.pdf]