
- 論文誌
- [1] H. Ochi, K. Yamaguchi, T. Fujimoto, J. Hotate, T. Kishimoto, T. Higashi, T. Imagawa, R. Doi, M. Tada, T. Sugibayashi, W. Takahashi, K. Wakabayashi, H. Onodera, Y. Mitsuyama, J. Yu, and M. Hashimoto, "Via-Switch FPGA: Highly-Dense Mixed-Grained Reconfigurable Architecture with Overlay Via-Switch Crossbars," IEEE Transactions on VLSI Systems, volume 26, number 12, pages 2723--2736, December 2018. [pdf]
- 国際会議
- [1] J. Hotate, T. Kishimoto, T. Higashi, H. Ochi, R. Doi, M. Tada, T. Sugibayashi, K. Wakabayashi, H. Onodera, Y. Mitsuyama, and M. Hashimoto, "A Highly-Dense Mixed Grained Reconfigurable Architecture with Overlay Crossbar Interconnect Using Via-Switch," Proceedings of International Conference on Field Programmable Logic and Applications (FPL), August 2016. [pdf]
- [2] R. Doi, J. Hotate, T. Kishimoto, T. Higashi, H. Ochi, M. Tada, T. Sugibayashi, K. Wakabayashi, H. Onodera, Y. Mitsuyama, and M. Hashimoto, "Highly-Dense Mixed Grained Reconfigurable Architecture with Via-Switch," ACM International Workshop on Timing Issues in the Specification and Synthesis of Digital Systems (TAU), March 2016.
- 研究会・全国大会等
- [1] J. Hotate, T. Kishimoto, T. Higashi, H. Ochi, R. Doi, M. Tada, T. Sugibayashi, K. Wakabayashi, H. Onodera, Y. Mitsuyama, and M. Hashimoto, "Highly-Dense Mixed Grained Reconfigurable Architecture with Via-Switch," Work in Progress Session, Design Automation Conference (DAC), June 2016.