Frequent tags in this search: analysis^:2 design^:2 flattening^:2 gradient^:2 on-chip^:2 soc^:2 temperature^:2 thermal^:2

4 publications are found. : URL for this page. : HTML

@article{id6,
         title = {On-chip thermal gradient analysis considering interdependence between leakage power and temperature},
        author = {T. Sato and J. Ichimiya and N. Ono and M. Hashimoto},
       journal = {IEICE Trans. on Fundamentals of Electronics, Communications and Computer Sciences},
        volume = {E89-A},
        number = {12},
         pages = {3491-3499},
         month = {12},
          year = {2006},
}

@article{id12,
         title = {On-chip thermal gradient analysis and temperature flattening for {SoC} design},
        author = {T. Sato and J. Ichimiya and N. Ono and K. Hachiya and M. Hashimoto},
       journal = {IEICE Trans. on Fundamentals of Electronics, Communications and Computer Sciences},
        volume = {E88-A},
        number = {12},
         pages = {3382-3389},
         month = {12},
          year = {2005},
}

@inproceedings{id54,
         title = {On-chip thermal gradient analysis and temperature flattening for {SoC} design},
        author = {T. Sato and N. Ono and J. Ichimiya and K. Hachiya and M. Hashimoto},
     booktitle = {Proceedings of Asia and South Pacific Design Automation Conference (ASP-DAC)},
         pages = {1074-1077},
         month = {1},
          year = {2005},
}

@inproceedings{id121,
         title = {フロアプランにおけるオンチップ熱ばらつきの解析と対策},
        author = {佐藤 高史 and 市宮 淳次 and 小野 信任 and 蜂屋 孝太郎 and 橋本 昌宜},
     booktitle = {情報処理学会DAシンポジウム},
         pages = {133-138},
         month = {7},
          year = {2004},
}